Professional Abrasives & Grinding Solutions +8615890168176

Abrasive Solutions

Providing high-purity abrasives and customized polishing solutions for various industrial applications worldwide.

Client: Electronic circuit substrate manufacturer

Problem: Required high-volume, defect-free finishing of ceramic wafers down to <5 µm thickness.

Solution: Provided Green Silicon Carbide Microgrits (#2000–#4000) for multi-stage lapping.

Result: High removal rates with negligible chipping or edge fracture. Yield increased by 22%, and wafer uniformity improved.

Client: Mobile electronics OEM supplier

Problem: Micro-scratches and haze appeared during final polishing of glass screens using standard cerium oxide powder.

Solution: Provided ultra-fine High-Purity Cerium Oxide (D50 < 1µm) with stable particle size and low contamination levels.

Result: Achieved high-gloss clarity with zero haze under 5x magnification. Polishing cycle shortened by 20%, and rework rate decreased dramatically.

Client: Aerospace repair facility

Problem: Delicate aluminum alloy components were being damaged by aggressive blasting media during cleaning.

Solution: Introduced Corn Cob and Walnut Shell abrasive mix for soft blasting with minimal erosion.

Result: All surface contaminants removed safely. No micro-cracking or pitting detected under microscope. Approved for regular MRO cleaning use.

Client: Digital ink manufacturer

Problem: Existing ceramic beads fractured during high-speed wet milling, contaminating the ink and reducing production yield.

Solution: Supplied Yttria-stabilized Zirconia Beads (ZrO₂ > 95%), high-density and wear-resistant.

Result: Zero fracture rate over 500 hours of operation. Ink color uniformity improved, and downtime dropped by 50%.

Client: Medical device optics supplier

Problem: High rejection rate due to micro-defects on lenses after polishing.

Solution: Switched to High-purity Cerium Oxide slurry optimized for glass index of refraction, used with low-pressure pad polishing system.

Result: Scratch visibility eliminated under 10x inspection. Yield rose to 98.7%, with faster throughput.

Client: Silicon wafer processor

Problem: Conventional abrasives couldn’t achieve the nanometer-level flatness required in CMP (Chemical Mechanical Polishing).

Solution: Provided Monocrystalline Diamond Micropowder (D20–D0.5) dispersed in custom slurry for final polishing.

Result: Surface flatness within <5 nm, with no crystal dislocation. Product qualified for use in 5nm chip fabrication lines.

Client: Dental materials manufacturer

Problem: After sintering, the zirconia dental blanks had inconsistent surface texture and required ultra-smoothness for CAD/CAM milling.

Solution: Employed Fine Green Silicon Carbide powder for intermediate lapping and White Fused Alumina for final polish.

Result: Achieved uniform, dense surface without microcracks. Tool wear during CAM milling decreased by 40%, with better crown finish.

Reach out for high-purity abrasives and customized polishing solutions.