Abrasive Solutions for the Electronics & Semiconductor Industry

Abrasives are crucial in the electronics and semiconductor industry for precision wafer slicing, dicing, lapping, and chemical mechanical polishing (CMP). They ensure ultra-flat surfaces, remove defects, and support the production of high-performance microchips and electronic components.

1. White Fused Alumina (WFA)

Applications: Polishing of ceramic substrates, alumina packages, and connectors

Functions: Fine grinding and lapping for flatness and surface quality

Features: High purity, chemical stability, sharp cutting edges

2. Cerium Oxide (CeO₂)

Applications: Final polishing of glass substrates, TFT-LCD, optical components

Functions: Chemical mechanical polishing (CMP) for ultra-smooth finishes

Features: Mild polishing action, excellent for defect-free surfaces

3. Silicon Carbide (Black/Green SiC)

Applications: Grinding of silicon wafers, ceramic materials, hard PCBs

Functions: Substrate shaping, cutting, and surface finishing

Features: Hard and sharp, thermally stable, good for hard brittle materials

4. Diamond Micron Powder

Applications: Ultra-precision polishing of semiconductor wafers, LED substrates, quartz glass

Functions: Nanometer-level surface finish for high-performance components

Features: Super hardness, uniform particle size, minimal scratching

5. Zirconium Oxide (ZrO₂)

Applications: Polishing of ceramic components, dielectric materials

Functions: High-precision grinding with low abrasion

Features: High melting point, chemically inert, good polishing behavior

Excellent quality abrasives! The variety of products meets all my polishing needs effectively and efficiently.

John Doe

★★★★★